Simulation provides key insights into the physics of solar cell operation, enabling engineers to explore the full range of design alternatives. At the module and system levels, behavioral models allow engineers to examine design trade-offs that can affect system performance - Solar Industry Magazine
May 11, 2010

This article describes two examples of the interaction between shallow trench isolation (STI) and transistor performance. The first example examines the impact of STI on the threshold voltage of narrow-width transistors—the so-called narrow-width effect. The second example addresses a larger area by considering the stresses induced by STI on nearby transistors - Solid State Technology
Feb 01, 2010

To help address growing challenges in semiconductor manufacturing cost and complexity, Toshiba has developed a simulation-based methodology to achieve fast yield ramp and reduced process development time and cost - Semiconductor International.
Dec 01, 2009

Recent model development and simulation case studies of multi-junction solar cells show the value of numerical simulation in cell design and optimization - PV World.
Jul 22, 2009

Ric Borges of Synopsys discusses the application of TCAD simulation to multijunction and CPV solar cells in a video interview with Debra Vogler of Solid State Technology.
Jul 16, 2009

Ric Borges, senior product marketing manager at Synopsys, reviews a range of photovoltaic technologies and explains how TCAD simulation can help engineers produce more efficient solar cells. Synopsys Insight, Issue 1, 2009
Mar 03, 2009

Developing SiC devices via tests on a range of prototypes is an expensive business. Simulations can slash the costs, but success demands carefully accounting for the material's anisotropy and very low intrinsic carrier concentrations.
Oct 30, 2008

Ric Borges, senior product marketing manager at Synopsys, talks to Pete Singer at Solid State Technology about Synopsys’ TCAD products for solar cell simulation.
Jul 14, 2008

We review various stress sources at the 45 nm node, discuss a methodology for treating the layout dependency, and examine the potential of hybrid-orientation technology (HOT).
Nov 16, 2007

White light-emitting diodes (LED) are currently a source of great research and commercial interest in view of the revolutionary energy-efficiency and cost-savings potential offered by solid-state lighting.
Jun 16, 2007

GaN HFETs are attracting considerable attention as high-power and high-frequency devices for radar, avionics and wireless base-station transmitters, thanks to the unique material properties of III-N material.
Jul 16, 2006

Design for Manufacturing (DFM) has taken off like a rocket in the electronics industry in recent years.
Jul 16, 2006

As chip costs escalate, the quest intensifies for DFM signoff models. Although everyone is searching for that one sure way to eliminate the respin nemesis, the challenge grows more daunting as process sizes shrink.
Feb 10, 2006

In implementing design-for-manufacturability (DFM) and design-for-yield (DFY) methodologies, it is necessary to go beyond layout printability issues and consider process variability. Technology CAD (TCAD) refers to the use of computer simulations to model semiconductor process and device behaviors.
Dec 16, 2005

As process tolerances decrease, significant yield losses are observed specifically due to differences between the design layout and how the resist actually prints on the wafer.
Dec 01, 2005

It's a tough job, but somebody's gotta do it. Every year, EDN's editors receive thousands of product announcements, and it's their job to narrow these thousands of choices into the hundreds of newsworthy items that each year grace the pages of EDN.
Oct 16, 2005

Compatibility with existing design methodology dictates the continued use of planar transistors at the 45nm technology node.
Jul 16, 2005

Since the 130 nm node, design complexity has been on a collision course with deep-submicron manufacturing issues, eventually leading to multiple respins and dramatic yield losses that culminated into the latest new field – design-for-manufacturing (DFM).
Jun 16, 2005

Although much progress has been made over the past few years to bridge the traditional gaps between the chip design and manufacturing communities, some of those involved can’t even settle on what the ubiquitous initialism DFM means: Is it design for manufacturing (the most common definition) or design for manufacturability (perhaps the more accurate one)?
Jun 16, 2005

Issues with manufacturability and yield are forcing the EDA industry and IC manufacturing to move closer together.
Apr 04, 2005