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One-stop shop provides easy-to-use USB 3.0 IP
Mar 04, 2010
Nikkei Electronics Asia: 1.066Gbps Signal Throughput in DDR3 with 4-Layer Boards
Dec 20, 2009
Chip Design: Adopting New Design Techniques in Analog IP to Optimize Power and Performance in Consumer Electronics
Dec 09, 2009
Chip Design: When It Comes To Intellectual Property, Size Matters
Nov 19, 2009
EDA DesignLine: The best of both worlds: Optimizing OCP slave memory behavior
Nov 09, 2009
Chip Design: Verifying USB 3.0 designs - it’s all about the integration
Oct 27, 2009
EDN: IP Quality Lies Beyond Compliance Testing
Oct 08, 2009
Chip Design: HDMI 1.4 - All Set to Take Over the Mobile World!
Sep 23, 2009
EDN Blog: Sometimes low-power design means picking the right IP
Jul 23, 2009
Chip Design: DDR Memory Interfaces - Addressing the Forgotten Bus
Jul 21, 2009
Electronic Design: A Summary Of The DDR Memory Controller Standard—Wait, There Isn’t One!
Aug 14, 2008
SCDsource: Selecting and Integrating Mixed-Signal IP
Jun 17, 2008
EDA DesignLine: Low Power Design for Analog/Mixed-Signal IP
Mar 04, 2008
SCDsource: Designers Highlight Challenges of High-Speed I/O
Nov 14, 2007
Chip Design: Certified Wireless USB and Ultra-wideband to the Rescue
Aug 15, 2007
EETimes: Letter to the Editor: Synopsys Weighs In
Aug 14, 2007
EETimes: Analog and Mixed-Signal Connectivity IP at 65nm and Below
May 07, 2007
ChipDesign Trends: Synopsys Prepares for Future Growth in IP Segment
Mar 15, 2007
ChipDesign Trends: Analog IP -- Ready for Prime Time?
Feb 15, 2007
DesignCon panel: 65-nm technology ready for mixed-signal designs; analog ICs, not so much
Jan 31, 2007
Electronic News: What's Right and Wrong with IP?
Aug 11, 2006
SOCcentral: Building a Total Quality Experience into Silicon IP
Aug 10, 2006
Electronic News: IP Reuse Can Usher in a Renaissance
Mar 30, 2005
Electronic News: Intellectual Quandary
Jan 14, 2005
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One-stop shop provides easy-to-use USB 3.0 IP
Nikkei Electronics Asia: 1.066Gbps Signal Throughput in DDR3 with 4-Layer Boards
Chip Design: Adopting New Design Techniques in Analog IP to Optimize Power and Performance in Consumer Electronics
Chip Design: When It Comes To Intellectual Property, Size Matters
EDA DesignLine: The best of both worlds: Optimizing OCP slave memory behavior
Chip Design: Verifying USB 3.0 designs - it’s all about the integration
EDN: IP Quality Lies Beyond Compliance Testing
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USB IP Blog: To USB or Not to USB
The Eyes Have it: A Mixed-Signal IP Blog
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K-Micro Meets High-Performance Requirements for Home Networking SoCs with DesignWare Data Converter IP
Netronome Selects Synopsys’ DesignWare DDR Controller and PHY IP for High-Performance Network Processor SoC
Ambarella Delivers Innovative Hybrid Camera SoC Platform with High-Quality DesignWare USB and Ethernet IP
GUC Delivers Low Power, High-Performance Solid State Drive SoC Platform with DesignWare SATA IP
Synopsys’ DesignWare® IP Helps STMicroelectronics Speed Time-to-Market for STM32 Connectivity Line of SoCs
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ChipWrights Achieves First-Pass Silicon Success and Meets Aggressive Schedule with High-Quality DesignWare USB and Ethernet IP
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How System-Level Trade-offs Drive Data Converter Decisions
A Survival Guide for Selecting High-Quality IP
Hi-Fi Audio: Unveiling the Hidden dBs
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Buying Time: Using Signal Integrity and Common Sense to Meet Timing Margins for High Speed Memory Interfaces
Guidelines for Mixed-Signal PHY IP Integration, Debug and Test
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TI Demonstrates USB 3.0 Interoperability at IDF with DesignWare IP
DesignWare IP for PCI Express 2.0 Complete Solution Demo
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